PhoQS project: Modelling and Optimization of Photonic Wirebonds

Overview

High-quality photonic interconnects enable technological advances, both in optical data transmission and in quantum research projects. In this research project, optical broadband coupling methods will be investigated. A nano-precise 3D printer can be used to fabricate structures for photonic interfaces. Important work packages of this project include the simulative investigation, optimization, and measurement of different coupling architectures. To be investigated are fiber-to-chip (end-facet or grating couplers) or chip-to-chip photonic interfacing (end-facet, grating couplers or other coupling types). Material platform-dependent recipes of the diverse coupling strategies will be developed.

Key Facts

Project duration:
09/2023 - 12/2024

More Information

Principal Investigators

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Prof. Dr.-Ing. J. Christoph Scheytt

System and Circuit Technology / Heinz Nixdorf Institut

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Prof. Dr. Klaus Jöns

Hybrid Quantum Photonic Devices

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Contact

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Christian Kress, M.Sc.

Transregional Collaborative Research Centre 142

Wissenschaftlicher Mitarbeiter

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Martin Miroslavov Mihaylov, M.Sc.

System and Circuit Technology / Heinz Nixdorf Institut

Wissenschaftlicher Mitarbeiter

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